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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.The film sealed technology includes whole-wafer operation, local-wafer operation and selective preservation

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: direct bonding.The effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.Besides, the reliability of silicon direct bonding with UV exposure enhancement after the high/low temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreasesdirect bonding.

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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A non-lithographic plasma nanoassembly technology for polymeric nanodot and silicon nanopillar fabrication

Athanasios Smyrnakis, Angelos Zeniou, Kamil Awsiuk, Vassilios Constantoudis, Evangelos Gogolides

Frontiers of Chemical Science and Engineering 2019, Volume 13, Issue 3,   Pages 475-484 doi: 10.1007/s11705-019-1809-0

Abstract: assembly method to both create the nanodot pattern on an etched polymeric (PMMA) film and transfer it to a siliconsubstrate for the fabrication of silicon nanopillars or cone-like nanostructuring.Pattern transfer to the silicon substrate using the same plasma reactor was performed in two ways: (a) a mixed fluorine-fluorocarbon-oxygen nanoscale etch plasma process was employed to fabricate silicon

Keywords： plasma     nanoassembly     etching     nanodots     nanopillars     nanofabrication    

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Research of the Preparation Technology for Zr66Al9Cu16Ni9Bulk Amorphous Alloy

Ruan Xuping,Ruan Hongwei

Strategic Study of CAE 2004, Volume 6, Issue 5,   Pages 76-78

Abstract:

The paper introduced the preparation technology for bulk amorphous alloys.The crystalloids of the samples were analyzed by using X - ray diffraction technology.

Keywords： bulk amorphous alloy     preparation technology     glass     fused salt     vacuum degree    

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Bulk Glassy Alloys: Historical Development and Current Research Review

Akihisa Inoue

Engineering 2015, Volume 1, Issue 2,   Pages 185-191 doi: 10.15302/J-ENG-2015038

Abstract:

This paper reviews the development of current research in bulk glassy alloys by focusing on the triggerpoint for the synthesis of the first bulk glassy alloys by the conventional mold casting method.This review covers the background, discovery, characteristics, and applications of bulk glassy alloysApplications of bulk glassy alloys have been expanding, particularly for Fe-based bulk glassy alloys,In the near future, the engineering importance of bulk glassy alloys is expected to increase steadily

Keywords： bulk glassy alloys     mold casting     metallic materials     structural relaxation    

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Research of the Relation Between Chemical Bonding Parameters and Difference in Atomic Size Ratios and

Cai Anhui,Pan Ye,Sun Guoxiong

Strategic Study of CAE 2004, Volume 6, Issue 7,   Pages 81-87

Abstract: The critical cooling velocity for forming glass (Rc) of the bulk metallic glass (BMG) was

Keywords： chemical bond parameters     difference of atomic size ratio     bulk metallic glasses     glass forming ability    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, andthen Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Region-gridding recycling of bulk organic waste: Emerging views based on coordinated urban and rural

Wenbing Tan, Dongyu Cui, Xiaohui Zhang, Beidou Xi

Frontiers of Environmental Science & Engineering 2020, Volume 14, Issue 6, doi: 10.1007/s11783-020-1291-4

Abstract: Abstract Bulk organic waste (BOW) has a large output in China.

Keywords： Bulk organic waste     Recycling     Urban-rural coordination     Management system    

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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Effects of nano-silicon and common silicon on lead uptake and translocation in two rice cultivars

Jianguo LIU,Hui CAI,Congcong MEI,Mingxin WANG

Frontiers of Environmental Science & Engineering 2015, Volume 9, Issue 5,   Pages 905-911 doi: 10.1007/s11783-015-0786-x

Abstract: The current study investigated the effects of nano-silicon (Si) and common Si on lead (Pb) toxicity,

Keywords： silicon (Si)     lead (Pb)     rice (Oryza sativa L.)     toxicity     accumulation    

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Changes in bulk soil affect the disease-suppressive rhizosphere microbiome against Fusarium wilt disease

Lin FU, Wu XIONG, Francisco DINI-ANDREOTE, Beibei WANG, Chengyuan TAO, Yunze RUAN, Zongzhuan SHEN, Rong LI, Qirong SHEN

Frontiers of Agricultural Science and Engineering 2020, Volume 7, Issue 3,   Pages 307-316 doi: 10.15302/J-FASE-2020328

Abstract: However, relatively little information is available about the relationship between bulk and rhizosphereHere, the assembly of banana bulk soil and rhizosphere microbiomes was investigated in a monocultureFinally, structural equation modeling was used to show that the changes in bulk soil bacterial community

Keywords： agricultural practice     bulk soil     disease suppression     rhizosphere ecology    

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Synthesis and bulk polymerization kinetics of monomer dehydroabietic acid-(2-acryloyloxy-ethoxy)-ethyl

Haibo ZHANG,Yanping YANG,He LIU,Jie SONG,Shibin SHANG,Zhanqian SONG

Frontiers of Agricultural Science and Engineering 2017, Volume 4, Issue 1,   Pages 97-105 doi: 10.15302/J-FASE-2016115

Abstract: A bulk polymerization monomer dehydro- abietic acid-(2-acryloyloxy-ethoxy)-ethyl ester (DHA-DG-AC) wasThe kinetics of the bulk polymerization of DHA-DG-AC was investigated by Differential Scanning Calorimeter

Keywords： dehydroabietic acid     bulk polymerization     kinetics     autocatalytic kinetic model    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of the bonding

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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Computer modeling of crystal growth of silicon for solar cells

Lijun LIU, Xin LIU, Zaoyang LI, Koichi KAKIMOTO

Frontiers in Energy 2011, Volume 5, Issue 3,   Pages 305-312 doi: 10.1007/s11708-011-0155-9

Abstract: A computer simulator with a global model of heat transfer during crystal growth of Si for solar cells is developed. The convective, conductive, and radiative heat transfers in the furnace are solved together in a coupled manner using the finite volume method. A three-dimensional (3D) global heat transfer model with 3D features is especially made suitable for any crystal growth, while the requirement for computer resources is kept permissible for engineering applications. A structured/unstructured combined mesh scheme is proposed to improve the efficiency and accuracy of the simulation. A dynamic model for the melt-crystal (mc) interface is developed to predict the phase interface behavior in a crystal growth process. Dynamic models for impurities and precipitates are also incorporated into the simulator. Applications of the computer simulator to Czochralski (CZ) growth processes and directional solidification processes of Si crystals for solar cells are introduced. Some typical results, including the turbulent melt flow in a large-scale crucible of a CZ-Si process, the dynamic behaviors of the mc interface, and the transport and distributions of impurities and precipitates, such as oxygen, carbon, and SiC particles, are presented and discussed. The findings show the importance of computer modeling as an effective tool in the analysis and improvement of crystal growth processes and furnace designs for solar Si material.

Keywords： computer modeling     silicon     crystal growth     solar cells    

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Title Author Date Type Operation

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

A non-lithographic plasma nanoassembly technology for polymeric nanodot and silicon nanopillar fabrication

Athanasios Smyrnakis, Angelos Zeniou, Kamil Awsiuk, Vassilios Constantoudis, Evangelos Gogolides

Journal Article

Research of the Preparation Technology for Zr66Al9Cu16Ni9Bulk Amorphous Alloy

Ruan Xuping,Ruan Hongwei

Journal Article

Bulk Glassy Alloys: Historical Development and Current Research

Akihisa Inoue

Journal Article

Research of the Relation Between Chemical Bonding Parameters and Difference in Atomic Size Ratios and

Cai Anhui,Pan Ye,Sun Guoxiong

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Region-gridding recycling of bulk organic waste: Emerging views based on coordinated urban and rural

Wenbing Tan, Dongyu Cui, Xiaohui Zhang, Beidou Xi

Journal Article

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

Effects of nano-silicon and common silicon on lead uptake and translocation in two rice cultivars

Jianguo LIU,Hui CAI,Congcong MEI,Mingxin WANG

Journal Article

Changes in bulk soil affect the disease-suppressive rhizosphere microbiome against Fusarium wilt disease

Lin FU, Wu XIONG, Francisco DINI-ANDREOTE, Beibei WANG, Chengyuan TAO, Yunze RUAN, Zongzhuan SHEN, Rong LI, Qirong SHEN

Journal Article

Synthesis and bulk polymerization kinetics of monomer dehydroabietic acid-(2-acryloyloxy-ethoxy)-ethyl

Haibo ZHANG,Yanping YANG,He LIU,Jie SONG,Shibin SHANG,Zhanqian SONG

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

Computer modeling of crystal growth of silicon for solar cells

Lijun LIU, Xin LIU, Zaoyang LI, Koichi KAKIMOTO

Journal Article